Thermal Interface Material
上市日期：
2022-11-16
Basic Description：
Thermal conductivity up to 12W/m-K,
Advanced FIP technology
● FRD has self-developed 11 categories over 80 products which provide total thermal solutions
● Provide 1-12 W/m·K widely conductivity grades
● Compliant with Canada and USA Flammable Retardant UL 94V0 Recognition
● Thermal FIP products available
Products
/
Featured Products
More
2024
-
09
-
18
型号：
HP-RTM (High Pressure Resin Transfer Molding) is the abbreviation of high pressure resin transfer molding process. It refers to the molding process of obtaining composite products by using high pressure to mix resin and inject it into a vacuum closed mold pre-paved with fiber reinforced materials, and then through resin flow filling, impregnation, curing and demoulding.Application examples on EV battery pack
2016
-
08
-
29
型号：
● High thermal conductivity, can be up to 150 to 1500 W/m·K@X-Y axis and 15 W/m·K@Z axis● Max. 200m length and 400mm width roll form available● Patented Envelope Sealing (edge-sealing) process● Sheet form, die-cut parts and roll form available
2022
-
11
-
16
型号：
● FRD has self-developed 11 categories over 80 products which provide total thermal solutions● Provide 1-12 W/m·K widely conductivity grades● Compliant with Canada and USA Flammable Retardant UL 94V0 Recognition● Thermal FIP products available