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Boron nitride film

Boron nitride film

上市日期: 2024-09-19
Basic Description:

The thermal conductivity can reach 60W/m · k

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It is a composite heat dissipation film based on two-dimensional boron nitride, which has excellent characteristics such as electromagnetic wave permeability, high thermal conductivity, high flexibility, high insulation, and low dielectric constant. It is used for heat dissipation in specific scenarios of electronic products such as smartphones.


Boron nitride film

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2024 - 09 - 18
型号:
HP-RTM (High Pressure Resin Transfer Molding) is the abbreviation of high pressure resin transfer molding process. It refers to the molding process of obtaining composite products by using high pressure to mix resin and inject it into a vacuum closed mold pre-paved with fiber reinforced materials, and then through resin flow filling, impregnation, curing and demoulding.Application examples on EV battery pack
2016 - 08 - 29
型号:
● High thermal conductivity, can be up to 150 to 1500 W/m·K@X-Y axis and 15 W/m·K@Z axis● Max. 200m length and 400mm width roll form available● Patented Envelope Sealing (edge-sealing) process● Sheet form, die-cut parts and roll form available
2022 - 11 - 16
型号:
● FRD has self-developed 6 categories over 80 products which provide total thermal solutions● Provide 1-12 W/m·K widely conductivity grades● Compliant with Canada and USA Flammable Retardant UL 94V0 Recognition● Thermal FIP products available
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